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2015 IEEE International Conference on Robotics and Biomimetics December 6-9, 2015, Zhuhai, China


Call for Late-News Submission: IEEE ROBIO 2015

2015 IEEE International Conference on Robotics and Biomimetics

December 6-9, 2015, Zhuhai, China


The 2015 International Conference on Robotics and Biomimetics (IEEE-ROBIO 2015) is calling for Late-News Submission.

Important Dates (updated):

Nov. 2, 2015 Late-News Paper Submission Deadline

Nov. 12, 2015 Notification of Acceptance

Nov, 25, 2015 Final Submission and Author Registration Deadline

The IEEE ROBIO 2015 conference will take place from December 6 to 9 2015 in Zhuhai, China. The theme of ROBIO 2015 is ”Bio-inspired Robots beyond Biomimetics”, reflecting the ever growing interests in research, development and applications in the dynamic and exciting areas of robotics and biomimetics. ROBIO 2015 promises to be a great event for researchers and scholars in robotics and biomimetics areas, with attractive technical and social programs. The ROBIO 2015 conference invites high quality original research and development papers in all areas related to robotics, biomimetics and related topics. 
Zhuhai is located in the Pearl River Delta, next to Macau.  The city was one of the original Special Economic Zones established in the 1980s, and is now one of China's premier tourist destinations (nicknamed the Chinese Riviera).  According to a report released in 2014 by the Chinese Academy of Social Sciences, Zhuhai is the most livable city in China. Visitors to Zhuhai can also visit Hong Kong, Shenzhen, or Guangzhou, which are all within 1 hour of transportation from the city. 

Contributed Papers:  Original papers are solicited in all related areas of robotics and biomimetics. Full papers must be submitted in PDF format prepared strictly following the IEEE PDF Requirements for Creating PDF Documents for the IEEE Xplore. For detailed format information, please visit the conference website. All accepted papers which are presented in the conference will be indexed by EI and included in IEEE Xplore.